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In November 2008, Yongsheng participated in a US exhibition
 Nov 03, 2008|View:178

From November 9th to 13th, 2008, Yongsheng Company will participate in the "PACK EXPO INTERNATIONAL" exhibition held at the McCormick Convention and Exhibition Center in Chicago, USA. Our booth number is E6345

At the exhibition, elites from various industries gathered together, with over 3000 exhibitors and nearly 50000 exhibitors participating. At that time, we will showcase the most advanced packaging machinery, transmission machinery, processing machinery, etc.

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